Product Type Features:Industry Application = Board-to-Board (Personal Systems/Computers), Mezzanine/Stacking (Multi-User), Networking (Communications)PCB Mounting Orientation = VerticalKeyed = NoTermination Related Features:Solder Tail Contact Plating = Tin-Lead over NickelBody Related Features:Centerline (mm [in])= 1.00 [0.039]Number of Positions= 64Board-to-Board Stack Height (mm [in])= 8.00 [0.315], 9.00 [0.354], 10.00 [0.394]Locating Post(s)= WithoutVacuum Cover= WithNumber of Rows = DualContact Related Features:Contact Plating, Mating Area, Material= Gold (30)Family Name = Free HeightContact Layout = In-LineContact Base Material = Copper AlloyHousing Related Features:Connector Style = ReceptacleHousing Color = BlackHousing Material = High Temperature ThermoplasticUL Flammability Rating = UL 94V-0Housing Material Temperature = HighIndustry Standards:RoHS/ELV Compliance= ELV compliant, 5 of 6 CompliantLead Free Solder Processes= Reflow solder capable to 245°C, Reflow solder capable to 260°CIndustry Standard = IEEE 1386 Mezzanine ConnectorPackaging Related Features:Packaging Method= Tape & ReelOther:Brand = AMP