使用开关时注意事项       1.IN CASE AN AUTOMATIC FLOW SOLDERING APPARATUS IS USE FOR SOLDERING             用自动焊接设备焊接时应参照如下条件ITEM项 目SOLDERING CONDITIONS焊接条件(1)PREHEAT TEMPERATURE预热温度100℃ MAX(AMBIENT TEMPERATURE OF PRINTED CIRCUIT BOARD ON ITS SOLDERING SIDE)(电路板周围焊锡面的温度)(2)PREHEAT TIME预热时间45 SEC MAX45秒MAX(3)FLUX FOAMING助焊剂浸泡TO SUCH AN EXTENT THAT FLUX WILL BE KEPT FLUSH WITH THE PRINTED CIRCUIT BOARDS,TOP SURFACE ON WHICH COMPONENTS ARE MOUNTED.PRDPARATORY FLUX MUST NOT BE APPLIED TO THAT SODE OF PRINTED CIRCUIT BOARD ON WHICH COMPONENTS ARE MOUNTED AND TO THE AREA WHIERE TERMINALS ARE LOCATED.助焊剂应涂在电路板上组装开关的印刷面上半部位，应防止助焊剂过量到电路板.(4)SOLDERINTEMPERATURE焊锡温度255℃ MAX255℃ MAX   (5)DURATION OF SOLDER IMMERSION焊接时间5 SEC MAX5秒 MAX(6)ALLOWABLEPREQUENCY允许重焊次数2 TIMES MAX2次  MAX       2.OTHER PRECAUTIONS其他注意事项         (1) FOLLOWING THE SOLDERING PROCESS,DO NOT TRY TO CLEAN THE SWITCH SOLVENT OR THE LIKE             进行焊接工艺时不应使用不整洁的东西对开关进行清洁。          (2) SAFEGUARD THE SWITCH ASSEMBLY AGAINST FLUX PENETRA TION FROM ITS TOP SIDE             在组装开关时应防止助焊剂从开关的上部流入到开关内部